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Consider the data on wafer contamination and location in the sputtering tool shown in Table 2-2. Assume that one wafer is selected at random from this set. Let A denote the event that a wafer contains four or more particles, and let B denote the event that a wafer is from the center of the sputtering tool. Determine:
(a) P (A)
(b) P (A|B)
(c) P (B)
(d) P (B|C)
(e) P (A ∩ B)
(f) P (A U B) |
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